Photoemission microscopy uses a powerful image intensification technology to amplify the light emitted by photo-emitting defect sites. The resulting radiation image is then overlaid with its corresponding die surface image, such that the emission spot coincides with the precise location of the defect. An infrared camera and a computer are used to accomplish this feature. Other failure analysis techniques are then performed to look for the physical anomaly responsible for the abnormal light emission.
Photoemission microscopy applications include but are not limited to the following :

Figure 1 shows the optical configuration of a versatile photon emission microscope. After removing the filter and beam splitter it can be used for just proving suspicious emissions. Alternatively, it can be used to overlay the radiation image and chip surface to better facilitate the localization of defects. This configuration can be expanded into a spectroscope by substituting beam splitter and filter by an appropriate dispersive element (basically also a filter). Spectral analysis of photon emissions promises to yield much more detailed information – because every defect has its own spectral signature. Most SWIR cameras
are already prepared for this task by offering a C-mount and mounting holes for a spectrometer.